半導体発光素子及びその製造方法

Semiconductor light-emitting element and manufacturing method of the same

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element and a manufacturing method of the same capable of omitting a protection element because if a protection element is flip chip mounted on a circuit board, the surrounding area of the protection element becomes dark, while an LED element can be mounted on a circuit board with a protection element because it is easily destroyed by static electricity and it is preferable to flip chip mount an LED element and a protection element on a circuit board, considering heat dissipation, productivity, and mounting area efficiency.SOLUTION: An LED element 13, flip chip mounted on a circuit board 12, comprises an n-side bump 23 as a cathode and a p-side bump 24 as an anode, and a varistor 26 is filled between the n-side bump 23 and the p-side bump 24. As a result, the static electricity countermeasures of the LED element 13 made by the varistor 26 remove the need of the protection element for the circuit board 12.
【課題】LED素子は静電気で破壊しやすいため保護素子とともに回路基板に実装されることがある。また放熱性や生産性、実装面積効率を考えるとLED素子及び保護素子を回路基板にフリップチップ実装することが好ましい。ところが保護素子を回路基板上にフリップチップ実装すると、保護素子の周辺が暗くなってしまうので保護素子を省きたい。 【解決手段】回路基板12上にフリップチップ実装されるLED素子13は、カソードであるn側バンプ23とアノードであるp側バンプ24を備え、このn側バンプ23とp側バンプ24の間にバリスタ26が充填されている。この結果バリスタ26によりLED素子13の静電気対策がとられるため回路基板12に保護素子が不要になった。 【選択図】図3

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Cited By (5)

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    EP-2858073-A3June 03, 2015Kabushiki Kaisha ToshibaRésine composite et dispositif électronique
    US-9136439-B2September 15, 2015Kabushiki Kaisha ToshibaSemiconductor light emitting device
    US-9419192-B2August 16, 2016Kabushiki Kaisha ToshibaComposite resin and electronic device
    US-9496471-B2November 15, 2016Kabushiki Kaisha ToshibaSemiconductor light emitting device
    US-9508697-B2November 29, 2016Samsung Electronics Co., Ltd.Semiconductor light emitting device and semiconductor light emitting device package including the same